Barkhausen Institut at the IEEE 6G Summit 2025
On May 14-15, 2025, the Barkhausen Institut will be participating in the IEEE 6G Summit in Dresden - with interactive demonstrators that provide insights into the future of secure and trustworthy electronic systems.
Visit us at centrally located booth 9, situated between the entrance and the StartUp Lounge, and experience these five interactive demonstrators:
Physical Layer Security (Project: Hexa-X-II):
Experience context-aware secret key generation from the wireless channel. This interactive demo showcases how secure keys can be derived directly from the physical layer of wireless communication – considering the surrounding environment. Visitors can actively change the environment and observe how different keys are generated in response.
Resilient 6G Networks (Project: 6G-ReS):
Engage with a miniature 6G network that showcases improved resilience using advanced O-RAN specifications. Visitors can deliberately disrupt the system and watch how it adapts to maintain secure connectivity.
Analog Chip Development (Research Topic: JCAS):
Explore a joint communication and sensing system powered by a custom-built analog chip. This demonstrator provides live feedback, giving insight into its dual capabilities in signal transmission and radar sensing.
Digital Chip Development (M³):
Try out the M³ platform, a hardware-software co-design that enhances digital system security by an innovative isolation layer. In this playful demo, visitors can participate in a Tic-Tac-Toe game and explore how security-by-design is enforced in a fun, hands-on way.
Science Communication (Project: SEMECO-Q1):
Dive into the complex world of the multi-faceted security challenges of connected medical devices. Hands-on features show visitors why a holistic approach is essential to designing safe and trustworthy systems.