COREnect: European Core Technologies for Future Connectivity

The aim of the "COREnect" (European Core Technologies for future connectivity systems and components) project is to provide the foundations for a sustainable European technology sovereignty in 5G and beyond. European industry and R&D leaders from both the microelectronics and telecommunications sectors will jointly develop a high-level strategic roadmap of core technologies for future connectivity systems and components, targeting the next generation telecommunications networks and services.

The strategic roadmap will cover the full 5G value chain including materials, components, subsystem integration, connectivity platforms and will address vertical industry sectors in areas such as health, energy, manufacturing, automotive and smart cities, among others.

Over the next ten years, 5G and then 6G are expected to connect billions of devices, digitise industries, and bring social and economic advances in many vertical sectors. Developing the necessary core technologies is crucial for Europe to decrease its dependence on non-European technologies.

By bringing together the microelectronics industry (electronic chip makers) and the telecommunications industry, COREnect will support the necessary coordinated and concrete actions to be taken in Europe.

This project has received funding from the European Union’s Horizon 2020 research and innovation programme under grant agreement N° 956830

Project duration: 2020-2022

Contact: Dr. Tim Hentschel, tim.hentschel@barkhauseninstitut.org

Cooperation partners:  Technische Universität Dresden, The 5G Infrastructure Association, AENEAS Robert Bosch GmbH, Commissariat à l'énergie atomique et aux énergies alternatives (CEA), Ericsson AB, Infineon Technologies AG, III-V lab, Australo Interinnov Marketing Lab SL, Interuniversitair Micro-Electronica Centrum (IMEC), NXP Semiconductors Netherlands B.V., STmicroelectronics SA